TECNO has introduced an innovative concept for the world’s thinnest modular smartphone at the Mobile World Congress (MWC) 2026 in Hong Kong. This groundbreaking technology, known as the Modular Magnetic Interconnection Technology, allows users to effortlessly attach and detach hardware modules without any added bulk. The TECNO Modular Phone aims to meet the increasing demands for advanced AI computing while addressing the spatial constraints of traditional smartphones.
The modular system features a sleek design that enables users to customize their devices according to specific needs. Attendees at the event will have the opportunity to see how the modular phone can be transformed into a versatile powerhouse by adding slim, high-performance modules. Unlike conventional smartphones, which are limited by fixed features, TECNO’s modular design offers flexibility, making it ideal for creators and professionals who require tailored solutions for various scenarios.
Distinct Editions and Personal Expression
The TECNO Modular Phone will be available in two unique editions. The ATOM edition showcases a minimalist design with a silver-aluminum body complemented by signature red accents, embodying the philosophy of “Rational Order with Personal Expression.” In contrast, the MODA edition embraces a bold, geek-inspired aesthetic. Both models highlight TECNO’s commitment to providing technology that adapts to individual user preferences.
Leo Li, the Product Head of Modular Magnetic Interconnection Technology at TECNO, emphasized the brand’s vision for technology that enhances user freedom. “We believe the ultimate goal of technology is not to create a static masterpiece, but to offer an extension of human freedom. By pioneering this modular architecture, we are breaking the constraints of fixed hardware and returning the power of choice to the user,” Li stated. He further elaborated on the potential of this modular ecosystem, describing it as “an experiment in mobile liberation.”
A Versatile Ecosystem for Everyday Needs
The modular ecosystem, built on TECNO’s innovative technology, currently includes approximately ten high-performance modules. These modules are designed to adapt to users’ evolving needs and environments, whether for professional photography, gaming, or extending battery life. This unique approach provides users with unparalleled flexibility to configure their devices according to their current situations.
Central to the TECNO Modular Phone is an exceptional design that redefines user experience. The base smartphone measures just 4.9 mm in thickness, while the accompanying POWER BANK module is a mere 4.5 mm. Even when combined, the total thickness remains comparable to standard smartphones, ensuring that modular expansion feels natural and maintains portability. The device features a high-quality glass back with an anti-glare treatment, creating a soft matte finish, alongside a polished metal frame that enhances durability and visual appeal.
Subtle lines on the back of the phone delineate eight modular zones, facilitating accessory placement and alignment while preserving the overall aesthetic. This thoughtful design illustrates TECNO’s forward-thinking approach to technology, which prioritizes adaptability and user-centric solutions.
As TECNO presents this modular concept at MWC 2026, it reflects the company’s long-term vision for technology that evolves alongside users. The Modular Magnetic Interconnection Technology embodies a future where smartphones are not simply devices but customizable platforms that enhance everyday life.
